Evidenziare: 
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                PCB laser depaneling machine, FPC UV laser depanelizer, high precision PCB laser cutter
                              

Peso:	1600 CHILOGRAMMI	Marchio laser:	Optowave
potenza del laser:	10 W	Lunghezza d'onda del laser:	355 nm
Alimentazione elettrica:	AC220 V	Spessore del materiale:	≤1,2 mm
Precisione di taglio:	μm ±20	Precisione della piattaforma:	μm ±2
Area di lavoro:	600*450 mm	Massima potenza:	3KW
Diametro del raggio:	20±5μm	temperatura ambiente:	20±2℃
Umidità ambientale:	<60%	Materiale della macchina:	Marmo
Dimensioni:	1480mm1360mm1412 millimetro

Peso:	1600 CHILOGRAMMI
Marchio laser:	Optowave
potenza del laser:	10 W
Lunghezza d'onda del laser:	355 nm
Alimentazione elettrica:	AC220 V
Spessore del materiale:	≤1,2 mm
Precisione di taglio:	μm ±20
Precisione della piattaforma:	μm ±2
Area di lavoro:	600*450 mm
Massima potenza:	3KW
Diametro del raggio:	20±5μm
temperatura ambiente:	20±2℃
Umidità ambientale:	<60%
Materiale della macchina:	Marmo
Dimensioni:	1480mm1360mm1412 millimetro

PCB Laser Depanelizer Machine. FPC UV Laser Depaneizer,High Precision Pcb Laser Cutting Equipment

PCB Laser Depanelizer Machine

FPC UV Laser Depanelizer - High Precision PCB Laser Cutting Equipment

Inline Laser Cutting Machine for Flexible Circuit Boards without Stress

Cutting Applications

FPC and related materials
FPC/PCB/Rigid-Flex PCB cutting
Camera module cutting

Key Features

Fast and efficient operation, reducing delivery time
High quality results with no distortion and clean, uniform surfaces
Integration of CNC technology, laser technology, and software technology
High accuracy and high-speed performance

Advantages of Laser PCB Depaneling/Singulation

No mechanical stress on substrates or circuits
No tooling cost or consumables required
Versatile applications with simple setting changes
Fiducial recognition for precise and clean cuts
Optical recognition before depaneling process begins
Ability to depanel virtually any substrate (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc.)
Extraordinary cut quality holding tolerances as small as < 50 microns
No design limitations - ability to cut virtually any size PCB board including complex contours and multidimensional boards

Technical Specifications

Parameter	Specification
Technical Parameters	Main body of laser: 1480mm × 1360mm × 1412mm
Power	AC220 V
Laser Wavelength	355 nm
Laser Source	Optowave 10W (US)
Material Thickness	≤ 1.2 mm
Precision	±20 μm
Platform Accuracy	±2 μm
Working Area	600 × 450 mm
Maximum Power	3 KW
Vibrating Mirror	CTI (US)
Spot Diameter	20 ± 5 μm
Ambient Temperature	20 ± 2 ℃
Ambient Humidity	< 60%
Machine Base	Marble